Building a Sustainable Ecosystem for the Packaging Industry Together, eSUN Invites You to Join SWOP 2023
2023-11-21
On November 22nd to 24th, Shanghai World of Packaging (swop) will be held at Shanghai New International Expo Centre (SNIEC). eSUN will showcase environmentally friendly packaging solutions, contributing to the creation of a sustainable ecosystem.
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eSUN Signed the Agreement for the Development Chain Cooperation of the Full Industry Chain of the PLA
2023-11-16
On November 14th 2023, the 10th International Conference of Technology & Applications of Biodegradable and Biobased Plastics (ICTABP10) opened in Wuhu, Anhui. Shenzhen Esun Industrial Co., Ltd. was invited to attend the conference.
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So Many Surprises! Remembering eSUN's Joyful Journey at formnext with Friends!
2023-11-11
The 2023 formnext in Germany is coming to an end. Undoubtedly, this exhibition is expected to set new records in both exhibitor scale and audience numbers.
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Congratulations to eSUN on the successful hosting of the “Two Meetings” — the European Agent Conference and the Makers Gala in Frankfurt!
2023-11-10
On November 9th, coinciding with the formnext in Germany, eSUN's “Two Meetings” — the European Agent Conference and the Makers Gala were successfully held in Frankfurt.
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Detailed Explanation of eSUNMed's Hard and Soft Power in the Direction of Microsphere Preparation
2023-11-09
eSUNMed is primarily dedicated to the development and application of biomedical polymer materials. Currently, we offer customized microsphere processing services tailored to user requirements. On one hand, eSUNMed can provide customers with various medical-grade raw materials, such as PLA, PDLLA, PCL, PLGA, PLCL, etc., with different molecular weights. On the other hand, we can customize solid microspheres of these polymers with diameters ranging from 20-100μm based on customer demands.
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Formnext in Germany | Gathering of Industry Leaders. eSUN Cordially Invites Everyone to Meet in Frankfurt!
2023-11-02
The Formnext 2023 in Germany will be held in Frankfurt from November 7th to 10th. At that time, eSUN will showcase various 3D printing materials and high-quality industry application cases at Booth 11.1-F59. Welcome to visit our booth. We are looking forward to meet you!
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ISO 5425:2023 published: 3D printing sector gets a boost with a new standard for PLA filament
2023-10-19
The International Organization for Standardization (ISO) released ISO 5425:2023 in August 2023. This new standard is titled "Specifications for the use of Poly(lactic acid) (PLA)-based filament in additive manufacturing applications."
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The first international standard for 3D printing filaments, led by eSUN, was officially released.
2023-09-27
In August of 2023, the international standard ISO 5425:2023, titled "Specifications for use of poly(lactic acid) based filament in additive manufacturing applications," led by China, was formally published by the International Organization for Standardization (ISO).
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10.03-10.06 25th PIR EXPO, LOOKING FORWARD TO YOUR VISIT
2023-09-26
25th PIR EXPO, 2023.10.03-10.06,Moscow,Russia.eSUN Booth:Hall 13 3C58, LOOKING FORWARD TO YOUR VISIT
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